Dr. Carl E. McCants, a special assistant to the director of the Defense Advanced Research Projects Agency (DARPA), will speak on the agency’s Microsystems Technology Office’s Electronics Resurgence Initiative (ERI). His Tech Tuesday presentation will provide an overview of ERI 2.0 and focus on some of the challenges related to manufacturing complex 3-D microsystems.
While ERI 2.0 will continue with the original six research thrusts, DARPA has added two additional thrusts – manufacturing complex 3-D microsystems, specifically
3-D Heterogeneously Integrated (3DHI) components, and electronics for extreme environments. Given that domestic semiconductor production accounts for only 12 percent of chip manufacturing and just 3 percent of packaging, there is a need to create ways in which innovation can be developed and leveraged for commercial and defense applications. ERI 2.0 will develop a domestic prototyping capability for 3DHI components to provide a sustainable path for innovation to move from the laboratory to industry.
Prior to his role at DARPA, McCants was technical director of the Supply Chain and Cyber Directorate of the National Counterintelligence and Security Center (NCSC) in the Office of the Director of National Intelligence. He provided scientific and technical input and briefed senior government leaders on national-level supply chain integrity issues and provided subject matter expertise on microelectronics-related supply chain concerns for the intelligence community and USG interagency groups. In addition, McCants was a Senior Program Manager at IARPA and a Program Manager at DARPA.
The presentation will take place at the IN3 offices in Odon, IN, and will include a light lunch and a networking opportunity.
For more information and to register, go to https://conta.cc/3xOmVW2.